Open-Close Type Soldering Lug (MGOC Series)

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Open-Close Type Soldering Lug (MGOC Series) — Copper, Indian Standards Open-Close Type Soldering Lug (MGOC Series) — Copper, Indian Standards — alternate view

Open-Close Type Soldering Lug

Technical Specification

  • Material 1897:2008

  • Reference standard Indian Standards

  • Surface TIN PLATED

  • Minimum operating temperature -50 °C

  • Maximum operating temperature 150 °C

Features

  • Annealed material optimizes material and crimping properties
  • ETP Electrolytic Grade Copper.
  • Tin-plated 5 micron plus to protect against corrosion.
  • Crack free crimping.
  • Bur free connection surface.
  • Lowest millivolt drop for DC current application.
  • Simple and safe connection.
  • Terminate power cables in high-voltage applications.
  • Provided with inspection hole to ensure the conductor has been fully inserted before crimping is done.
  • Flat contact surface to avoid hotspot.

MATERIAL ETP COPPER IS : 1897:2008

SURFACE: TIN PLATED

Size mm2

E

A

D

F

B

L-1

J

MG CAT NO.

Crimping Tools Code

1.5 4.2 1.6 7 0.8 5 11.5 15 MGOC-371
2.5 5.2 2.3 9 0.8 6 13.5 18 MGOC-372
4 5.2 2.8 9 1 6 15.5 20 MGOC-373
6 6.5 3.6 12 1 7 18 24 MGOC-374
10 6.5 4.4 12 1 9 21 27 MGOC-375
16 8.2 5.4 15 1.2 11 24.5 32 MGOC-376
25 8.2 7 15 1.6 14 28.5 36 MGOC-377
35 8.2 8 18 1.6 15 32 41 MGOC-378
50 10.2 9.5 24 1.8 18 38 50 MGOC-379
70 10.2 11.8 28 2 23 44 58 MGOC-380
95 12.7 13.5 32 2.6 25 50 66 MGOC-381
120 12.7 15.5 34 2.8 29 56 73 MGOC-382
150 12.7 16.5 38 3.2 30 60 79 MGOC-383
185 16.2 18.5 42 3.6 35 66 87 MGOC-384
225 16.2 21 44 3.6 40 70 92 MGOC-385
240 16.2 22.5 48 4 42 76 100 MGOC-386
300 20.3 25 54 4.5 45 83 110 MGOC-387
400 20.3 29.5 62 5 54 94 125 MGOC-388
500 20.3 32 62 5.4 58 106 137 MGOC-389
625 20.3 36 70 5.4 65 113 148 MGOC-390

25 *All dimensions are in mm